Used WINGO L-3250 #9043141 for sale

WINGO L-3250 is a precision grinding, lapping, and polishing equipment designed for the precise engineering and production of extremely thin, flat components. This system offers an innovative solution for handling the precision finishing of thin, wafer components. The unit offers a comprehensive range of capabilities including grinding, lapping, and polishing for a wide variety of materials used in thin wafer-based components. It features a unique dual head design, The machine has a main base positioned in-line with a robotic platform, which moves along the orbital guide track. This allows the simultaneous grinding and polishing of both surfaces of the wafer. Two grinding and polishing heads work together on each side of the wafer, eliminating any contact between them; thus, providing uniform results across all wafer surfaces. The tool is also equipped with a fully automated substrate handling asset; allowing loading to be handled via a single operation. The loading process can thus be customized for a wide variety of substrates. Furthermore, the loading platform allows for the use of multiple substrates at the same time; permitting grinding and polishing of various wafer sizes and configurations. This allows for higher throughput rates and improved overall consistency. The model also features auto-switching capabilities allowing for dynamic grinding and polishing, allowing for rapid adjustment and optimization of the process. In addition to this, the equipment also includes an automatic control system for monitoring the grinding and polishing progress of the wafer. The unit is also designed to be flexible and easily adaptable, allowing for quick changeover between different types of materials. This versatility is further enhanced by its compatibility with a wide range of grinding and polishing consumables. L-3250 is ideal for the precision grinding, lapping, and polishing of thin wafer components used in applications such as electronics, medical device manufacturing, automotive industries, aerospace, and many more. This machine provides flexibility through its advanced automated handling tool and comprehensive grinding and polishing capabilities. The asset also ensures consistency through its advanced auto-switching and control model, allowing for precise and efficient results.