Used WINGO L-3250 #9050602 for sale

WINGO L-3250 is a high-performance wafer grinding, lapping and polishing system designed to process both silicon, gallium arsenide and other semiconductor materials. It is ideal for the eventual production of varying sizes of electrical and electronics components. L-3250 consists of a grinding disk that is driven by a powerful and efficient electric motor. The powerful motor drive provides precise speed control and smoothness of operation, reducing vibration to a minimum. WINGO L-3250 is capable of grinding and lapping double side or single side of plano surfaces with superior surface flatness tolerance at high precision. The robust mechanical design of L-3250 ensures extended life cycle and reliable operation. It is designed to operate with a wide range of grinding disks. Further, the spindle drive is outfitted with a three-phase AC induction motor, all of which provide precise and reliable performance, while the spindle axial and radial runouts are minimized through the use of radial and axial air bearings. In addition to its grinding and lapping operations, WINGO L-3250 is equipped with a dual-axis spindle loading mechanism, which enables precise loading of the workpiece with high repeatability. This spindle loading is particularly advantageous for the processing of very small workpieces. Furthermore, the operation functions are all optimized for simplicity during operation. L-3250 is made from tough and highly reliable materials, with long-term stability and compatibility with a wide range of production environments. WINGO L-3250 also enhances operator safety, as its grinding operational functions are equipped with multiple protection features. L-3250 offers superior grinding, lapping, and polishing capabilities. It offers unrivaled precision and performance, with its excellent drive power, smooth operation, and its powerful and efficient motor drive. The high-performance WINGO L-3250 makes it an ideal choice for various wafer industry production needs.