Used WINSLOMATIC 100B #9001191 for sale

WINSLOMATIC 100B Wafer Grinding, Lapping & Polishing Equipment is a high-precision, automated solution for processing semiconductor wafers. The system is capable of grinding, lapping and polishing up to 10 wafers with fast cycle times and high yield. 100B achieves flat and smooth final surfaces on both thin and thick wafers as well as non-planar shapes using its proprietary Star Grinding technology. The unit also features auto-focus which provides uniform metrology across the entire surface of each wafer. The machine is equipped with a pair of spinning grinding discs which can be adjusted to mirror each other and create the desired surface finish. The discs are made of ceramic and can be used to create both rough and smooth surfaces on the wafer. The discs can be set to run in either lapping or grinding mode and are capable of rotating at up to 3500rpm. The lapping capability of the tool begins with specially designed abrasive pads composed of alumina and silica particles. These pads are placed over the wafer and automatically dispense a solution of diamond or silicon-carbide pastes which are applied to both surfaces of the wafer and the abrasive pads. The paste is then quickly and precisely polished with the lapping discs at extremely high speeds. The polishing capability of the asset employs application specific slicks that are designed to prepare the surfaces for metrology. These slicks come in a variety of shapes and sizes to accommodate various wafer shapes and thicknesses. The slicks are then placed over the wafers and a polishing solution is dispensed onto the wafer and the abrasive pads. This solution is then carefully polished by the spinning discs to achieve a perfectly flat surface. WINSLOMATIC 100B model provides consistent results every time and meets the highest quality standards. The equipment is easy to use and provides the user with precise control over the grinding, lapping and polishing processes. This system is the perfect solution for any semiconductor wafer processing needs.