Used WINSLOMATIC 400 #9001194 for sale

WINSLOMATIC 400 is an advanced wafer grinding, lapping and polishing system, designed to provide a high-quality surface finish on a wide range of substrates. It combines the latest in grinding, lapping and polishing technology to deliver superior accuracy and repeatability. 400 offers full grinding, lapping and polishing capability with its three-step process. The machine is designed to grind, lap and polish substrates in one continuous cycle, providing a quality finish. The grinding process utilizes fixed diamond abrasive tools to grind down the substrate to the required level of finish. This process is followed by a lapping process where the substrate is wet-lapped with a specially formulated slurry and diamond laps. This process ensures a consistent thickness across the substrate, allowing for uniform polishing results. Finally, the polishing process utilizes oil combined with fine diamond abrasives to give the desired high-gloss finish. The polishing process is customizable to the desired finish requirements. The lapping and grinding steps ensure an extremely flat and smooth finish. WINSLOMATIC 400 is capable of polishing parts from a wide range of metals and materials including, copper, silicon, stainless steel, nickel, titanium and many others. It is also capable of polishing a variety of substrates such as wafers, bars, rods, disks, tubes and more. The system is equipped with a high-resolution system for accurately measuring the mechanical properties of the parts, giving users full control over their processes. 400 is designed to provide a superior surface finish with exacting accuracy and repeatability. With its easy to use controls and a wide range of features, it is an essential tool for any wafer grinding, lapping and polishing application.