Used YASKAWA 8000 #293623228 for sale

YASKAWA 8000 wafer grinding, lapping and polishing equipment is a multi-functional tool designed to provide state-of-the-art processing capabilities for a variety of electronic, optical, and semiconductor applications. This system is designed to offer wafer grinding and polishing of flat substrates and bonded wafers in a single integrated unit. 8000's high-precision grinding and polishing process is ideal for processing transparent or semi-transparent materials used in a variety of future technologies, such as LCD, opto-electronics and semiconductor production. The machine is equipped with multiple grinding and polishing heads, allowing for simultaneous processing of up to eight wafers in one cycle. It also supports up to eight different combinations of grinders, including polishers and grinders. YASKAWA 8000 features an X-Y axis displacement mechanism that provides precise orientation of the processing heads, thereby allowing for efficient and uniform processing of the wafers. An integrated vision machine and positioners allow the machine to accurately locate the wafers in different positions during the grinding and polishing operation. The stage is capable of performing both high-precision wafer grinding as well as platen based lapping and polishing tasks, in single or multiple pass operations. The tool is controlled with a PC-based controller that allows for easy and efficient set-up, operation and monitoring of the grinding and polishing process. The asset also offers a variety of software tools for efficient control of the processing parameters and simulation of the processes. A data-logging model allows users to store the machining information and keep records of the process results. 8000 also comes with multiple safety features, such as an emergency stop button, interlocking panels and a double buzzer equipment. The design is also capable of achieving a low-noise operation of < 75db at the operator's ear. The system also uses environment friendly components and materials allowing for clean, dust free operations. Overall, YASKAWA 8000 is a multi-functional, state-of-the-art wafer grinding, lapping and polishing unit that can provide efficient and precise results. With a variety of features, it is an ideal machine for the processing needs of high technology industries.