Used YOKOGAWA / MUSASHINO ELECTRIC CS-203 #9311813 for sale

YOKOGAWA / MUSASHINO ELECTRIC CS-203
ID: 9311813
Wire saw.
YOKOGAWA / MUSASHINO ELECTRIC CS-203 is a wafer grinding, lapping & polishing equipment for precision engineering and semiconductor manufacture. This machine combines the latest advances in computer-assisted manufacturing in a compact, fully automated design. YOKOGAWA CS-203 is able to achieve high rates of production with effective grinding, lapping, and polishing of both flat and curved surfaces on silicon wafers up to 200mm in diameter. MUSASHINO ELECTRIC CS-203 starts with a wafer placed on a support plate. The wafer is then pre-ground with a diamond wheel, which can be adjusted to achieve the desired profile. The wafer is then moved onto a diamond finishing wheel. The wheel is able to achieve nanometer level surface finishes, suitable for precise electronics and semiconductor production. The lapping process is then used to further refine the finish of the wafer. A diamond pad is used to apply an abrasive slurry for exacting control of finish quality. The polishing process is then used to achieve surface planarity as well as a mirror-like finish. CS-203 employs a precision polishing head with an adjustable polishing nozzle. A slurry feed system allows the precise adjustment of polishing pressure and optimum pressure delivery for uniform results. Once the desired finish is achieved, the slurry is then removed and the wafer is cleaned to remove any polishing residues. YOKOGAWA / MUSASHINO ELECTRIC CS-203 is easy to program and operate, and features simple-to-use position setting, control, and monitoring systems. In addition, the machine is capable of fast, repeatable setup and process jobs with a minimum of mechanical changes. The movement of the arm and the rotational speed of grinding have adjustable speed ranges to allow optimum results. A built-in Auto Tune unit allows the machine to automatically set parameters and store the results in the machine memory, allowing for quick set up between runs. YOKOGAWA CS-203 is ideal for high-precision wafer grinding, lapping, and polishing. With its ease of programming and operation, fast setup times, and precise results, MUSASHINO ELECTRIC CS-203 offers a reliable, cost-effective solution to the challenging demands of precision engineering and semiconductor production.
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