Used YOKOGAWA / MUSASHINO ELECTRIC MA-200D #9257656 for sale

YOKOGAWA / MUSASHINO ELECTRIC MA-200D is a state-of-the-art wafer grinding, lapping, and polishing equipment. YOKOGAWA MA-200D is capable of processing any type of wafer up to 200mm in diameter, including both silicon and sapphire. Its unique design allows the system to reduce grinding run times by up to 90%, ensuring the highest accuracy and precision in grinding and lapping/polishing operations. The unit is composed of three main components: a grinding/lapping head, a spindle head, and a polishing head. The grinding/lapping head is equipped with a heavy duty DC motor and stepper motor to achieve a high accuracy and extremely low vibration. The motor is further controlled by a vector control and multi-axis digital servo machine, allowing for precise control over cutting speed and feed rate. The spindle head features a highly accurate and repeatable plunge feed for deep grooves and holes. Lastly, the polishing head is equipped with a high-torque permanent magnet drive motor with variable speed and torque control, providing an optimum solution for all polishing requirements. MUSASHINO ELECTRIC MA-200D also offers a range of optional accessories including a separator for inner and outer diameters on cylindrical workpieces, a vibration isolator for efficient grinding/lapping and polishing operations, and a diamond grinding wheel for maximum polishing accuracy. Additionally, the tool is equipped with a safety interlock asset for operator and machine safety. Overall, MA-200D is an excellent choice for high precision wafer grinding, lapping, and polishing operations. Its advanced motor and servo control model, along with its safety interlock equipment, make it the ideal choice for any wafer processing job.