Used YOKOGAWA / MUSASHINO ELECTRIC MA-4000 #9294727 for sale

YOKOGAWA / MUSASHINO ELECTRIC MA-4000 is a state-of-the-art wafer grinding, lapping & polishing equipment designed specifically for the processing of semiconductor wafers. YOKOGAWA MA-4000's unique design utilizes advanced technology and proven manufacturing techniques to provide superior, consistent results while maximizing productivity. MUSASHINO ELECTRIC MA-4000 is equipped with an array of advanced features that increase uptime and productivity, while consistently producing quality wafers. The system's grinding head features an embedded, high-power brushless DC motor for high-precision grinding and slicing of wafers. The high-torque motor offers 4 speed settings and is precisely controlled to ensure uniform and precise grinding results. The robust grinding head is also able to traverse across a range of angles for maximum flexibility and precision. MA-4000 also features an in-situ lapping unit designed to lap both sides of the wafer simultaneously. The machine's lapping head is both adjustable and extendable to enable simultaneous lapping of both sides of the wafer in a single step. This lapping process uses diamond-abrasive impregnated disc polishing pads to quickly and efficiently lap the wafer to precise surface flatness. This lapping head is adjustable and can be fine-tuned to achieve precisely the desired results. YOKOGAWA / MUSASHINO ELECTRIC MA-4000 also utilizes a polishing station equipped with a stainless-steel basket to polish and clean wafers. This high-precision polishing station is able to accommodate up to eight wafers at a time and incorporates a unique anti-galling mechanism for superior surface quality. In order to facilitate precise results, YOKOGAWA MA-4000's polishing station features a wide range of adjustable parameters including polishing force, stroke amplitude, rotation speed, and pressure drop. Overall, MUSASHINO ELECTRIC MA-4000 wafer grinding, lapping and polishing tool offers a wide range of advanced features and processes to maximize production efficiency and consistent quality. It is the ideal asset for high-throughput, cost-effective and precise wafer processing.