Used YOSHIKAWA YGS-16RF #9248236 for sale

YOSHIKAWA YGS-16RF is a wafer grinding, lapping and polishing equipment designed to provide precise and efficient polishing of flat surfaces on a variety of materials. The system utilizes a four-stage process consisting of grinding, lapping, polishing and an optional passivation process for improving surface finish. The unit includes a variable-speed motor for controlling the motion of grinding and lapping plates. The grinding plates are made of steel or diamond embedded resin which allows for high-precision grinding and lapping of surfaces. The lapping plate is made of a unique blend of abrasive media combined to create a higher degree of finish. The polishing plate is constructed from a unique blend of abrasive materials to provide a high level of uniform finish on the material. The machine also includes a taper stage for removing damage such as scratches, chips and other irregularities. The taper stage uses a set of specialty diamond-embedded tools which are designed to quickly and effectively remove any surface damage. The tool is integrated with a control asset to monitor and adjust the speed of the grinding plates for improved accuracy. Additionally, the model also includes an optional passivation equipment which adds an additional protective layer to the polished surface. This helps to seal and protect the surface from external contaminants. YGS-16RF system provides excellent repeatability, offering reliable results on every job. Furthermore, the unit is capable of handling wafers up to 4-inch in diameter, allowing for the processing of a wide range of materials. It is also highly reliable and durable, as it is constructed with high-grade components and able to withstand the harsh environment conditions found in production and field applications. Additionally, the machine is backed by a comprehensive warranty program, giving users the peace of mind of knowing their equipment is protected by the best in the industry.