Used YOSHIKAWA YGS18-18RFD #9221131 for sale

YOSHIKAWA YGS18-18RFD is a fully automated and versatile wafer grinding, lapping and polishing equipment. It is designed with improved advanced process control algorithms to offer high processing accuracy and flexibility. It can grind and lap up to 18 wafers with a maximum diameter of 150 mm in a single cycle. YGS18-18RFD is powered by an advanced control system that is designed to manage the complete process by accurately controlling the speed, pressure and motion paths to ensure a consistent result throughout the entire production cycle. It is also equipped with low vibration design and cooling water circulation for heat dissipation. YOSHIKAWA YGS18-18RFD also has a wide range of platters for different wafer sizes that can be quickly swapped, reducing downtime. YGS18-18RFD is designed with a number of integrative features such as a vision unit which can detect defects on the surface before grinding, a particle monitor for slurry, and a function for controlling pad position during lapping processes, allowing for increased precision and control. This guarantees consistent, high quality wafers after each run. In addition, YOSHIKAWA YGS18-18RFD has an advanced process control feature, which enables automated process execution. This makes it easy to set up and operate and reduces human error. YGS18-18RFD also has an automatic wafer loading and unloading machine, which ensures that the production process is safe and efficient. YOSHIKAWA YGS18-18RFD is a powerful, efficient and versatile tool that can be used in a wide range of wafer grinding, lapping and polishing applications. Its advanced process control features, high processing accuracy and superior flexibility make it an ideal choice for any production facility looking to improve its production process. With its wide range of attachments, integrated safety features and automated process operation, YGS18-18RFD is the perfect solution for fast, efficient and cost-effective wafer processing.