Used YUHIDENSHI U-ED-208 #9390956 for sale

YUHIDENSHI U-ED-208 is a high-precision wafer grinding, lapping and polishing system designed for grinding, lapping, and polishing various types of wafer materials, including silicon, gallium arsenide, glass, GaN, photoresist and more. The unit is capable of achieving accuracy to 0.0001 mm (1 nanometer) and capable of producing polished surfaces with the highest precision. U-ED-208 features a high-speed spindle powered by an AC motor driven by a DC servo drive. This spindle is coupled with two tables that provide precision grinding and polishing and variable speed control, allowing for smooth operation. The system is equipped with four grinding and polishing platens, each of which has a diameter of 200mm. The platen spins at speeds ranging from 5,000 to 10,000 rpm and the setup includes a timer to help the operator monitor the process. The versatility of YUHIDENSHI U-ED-208 is enhanced by its modular design. It's possible to add, remove and reposition the grinding and polishing platens quickly, allowing for different types of operations with minimal setup. It is also possible to set up the system for single or double-sided processing, as well as serial or parallel processing. U-ED-208 is capable of bead blasting, grinding, and sandblasting with a range of abrasives. The unit comes with three built-in static wafer holders with precision centering, designed for use with wafers up to 200mm. It is also possible to attach special wafer holders that can handle non-standard substrates. YUHIDENSHI U-ED-208 provides a full range of safety features to protect the unit and operator, including emergency stop buttons, low voltage wiring, E-stop buttons, and a safety plastic guard to protect against hazardous particles. U-ED-208 is an ideal choice for wafer processing operations in semiconductor, optoelectronic, MEMs and CCDs operations, due to its outstanding performance, flexibility, and excellent safety features. With its modular design and wide range of process capabilities, it is the perfect solution for grinding, lapping, and polishing a variety of wafer materials with accuracy, speed and reliability.