Used YUHIDENSHI UH-I-6200 #9247797 for sale

YUHIDENSHI UH-I-6200 is an automated wafer grinding, lapping and polishing equipment designed to meet the growing demands of the semiconductor industry for circuit designs that require flatness, surface finish, and shape accuracy. This unique and robust system features an efficient spindle drive, integrated process controller, user-friendly operator console, and advanced adjustment functions. The unit is capable of grinding, lapping, and polishing various types of semiconductor wafers with high accuracy and consistency. The integrated controller allows for precise speed and power settings throughout the process and is equipped with an intuitive user interface for easy settings adjustment and monitoring. The machine also features a flexible spindle machine for thin-film wafer polishing, and a self-diagnosing safety function to ensure a safe and correct operation. UH-I-6200 offers consistent and reliable results with an excellent surface finish, making it suitable for a wide range of applications. The tool is designed for high precision wafer processing, resulting in a finer surface and improved dimensional accuracy. The robust construction of the machine and the automated process control asset enable consistent results in all processes. YUHIDENSHI UH-I-6200 is equipped with an advanced motorized speed controller, enabling users to adjust process speeds precisely. The model also includes a wafer loading mode, allowing for quick and easy loading and unloading of the wafers. The integrated indicator display offers clear and intuitive control of the equipment functions. The user friendly and intuitive interface allows for fast and easy setup and program selection. In addition, the machine is equipped with a water cooling system for wafer processing, providing proper control over the temperature of the wafer. This helps ensure consistent and repeatable results. The unit is able to reach a surface roughness of 6µm, and a step height accuracy of +/- 0.1µm. UH-I-6200 is an advanced, automated machine designed to meet the demanding requirements of the semiconductor industry for precision wafer grinding, lapping and polishing. The integrated controller, user-friendly operator console, and advanced adjustment features enable users to produce top-quality semiconductor wafers.