Used YUHIDENSHI UH-I-6200 #9390943 for sale

YUHIDENSHI UH-I-6200 is a wafer grinding, lapping and polishing equipment designed for high precision, high performance operations. It is an ideal machine for high precision applications in the semiconductor industry. The system utilizes advanced technology, such as a multi-axis spindle drive that enables fast and precise grinding and lapping functions. The machine also has an automated touch sensor for precise positioning and an integrated workholding table for easy placement and set up of both lapping and grinding operations. The machine operates on aa rotating diamond plate that is kept in constant contact with the wafer surface. This is done to ensure that the surface finish of the wafer is both even and highly accurate. The diamond plate itself is attached to a motorized spindle that is driven by a servo motor, allowing for accurate feed rates and cycles. This ensures low-residual stress and high levels of surface finish. The machine also has an extremely robust construction, with an all-hardened sealed bearing construction manual movement. The spindle is made from hardened carbon steel and both the grinding and lapping discs are constructed from premium grade aluminum oxide ceramic. This construction allows for a continuously consistent grinding pressure, low wear, low vibration and excellent abrasive cut rates. A precision digital touch sensor is also installed on the machine, which allows for precise positioning of the same, and a work holding table allows for the easy placement and set up of lapping and grinding operations. This table has adjustable suction cups for secure fixturing of work pieces, and its built-in vibration dampening unit preserves workpiece integrity as well as the cutting integrity of the grinding wheel. UH-I-6200 also has a high-powered cooling machine that is designed to reduce friction and extend abrasive life, as well as reduce surface temperatures and improve surface finish. The external cooling tool further prevents dust contamination on the wafer during grinding and polishing operations. The machine is easy to use and requires minimal maintenance, making it a reliable and cost-effective option for any high precision production requirement. Within minutes of set up, operators can begin to operate the machine to grind and polish wafers. The machine can also easily handle a wide range of wafer sizes, from 200mm to 300mm and has a high-speed rotation and cutting ability.