Used YUHIDENSHI UH-I-6200A #9148286 for sale

YUHIDENSHI UH-I-6200A is an advanced wafer grinding, lapping, and polishing equipment capable of producing very high surface uniformity and extremely low roughness values for silicon wafers. UH-I-6200A utilizes a dual blade design providing parallel cutting of the wafer. The system is able to process up to four wafers of differing sizes simultaneously with diamond lapping and grinding wheels. Powered by a brushless DC motor, the unit can spin up to 3,000rpm with a spindle control accuracy of ±0.1rpm. The upper and lower grinding and polishing wheels have a diameter of up to 200 mm and are adjustable up to an accuracy of ±1 μm, allowing for precise adjustment and grinding of the surfaces. The machine is designed with a built-in miniloader, allowing automatically loading and unloading of wafers. The micro-controlled loading fork is of particular importance, as it allows precise, repeatable adjustments and quick grinding operations with minimal downtime and minimal drifting of the blade. YUHIDENSHI UH-I-6200A is constructed from anodized aluminum and stainless steel for robust operation, better heat dissipation, and improved chemical and corrosion resistance. Its side panel accepts a variety of kind accessories and tools, making it a versatile tool for both in-lab and production-oriented grinding and polishing applications. The asset features an intuitive graphical user interface (GUI), allowing for complete control of process parameters for precise part grinding. The interface provides real-time feedback on grinding status and allows for programming of different grinding programs for wafer preparation. An autogenerator of grinding history records is also included, making it possible to store up to five program steps, as well as parameters and any selected parameters for future reuse. Moreover, UH-I-6200A is designed to operate in standalone or PC-interfaced mode. Three software modes are available: manual, semi-automatic, or automatic, allowing users to precisely control the grinding and polishing processes. An optional Ring-Binder Handle allows easy and safe transportation of the model between different production areas. YUHIDENSHI UH-I-6200A is a modular, versatile, and reliable tool for professional and production-oriented wafer grinding, lapping, and polishing operations. Its high accuracy, repeatability, and compatibility with different sizes of wafers make UH-I-6200A a powerful and reliable tool for both in-lab and production-oriented applications.