Used YUHIDENSHI UH-I-6200A #9261617 for sale

YUHIDENSHI UH-I-6200A wafer grinding, lapping, and polishing equipment is a highly successful and effective machine for performing surface preparation, preparation of single layer or multilayer substrates, and polishing of ultra-thin wafers. UH-I-6200A features a broad set of features that provide both precision and efficiency for processing large quantities of substrates. YUHIDENSHI UH-I-6200A is built to provide high quality grinding, lapping, and polishing of ultra-thin wafers for semiconductor, flat panel display, optical, and data storage applications. It is specifically designed to maintain accuracy and repeatability across repeatedly run batches of substrates of similar sizes and shapes. UH-I-6200A utilizes a powerful four-piece grinding head setup that can be configured for each application. This includes a standard, a low-profile, a high-angle, and a sub-angle grinding heads with individually adjustable speeds from 30 revolutions per minute (RPM) up to 3,400 RPM. The grinding heats are suitable for lapping wafers in sizes from 3-inch (7.62 cm) to 6-inch (15.24 cm). YUHIDENSHI UH-I-6200A is equipped with an air-bearing spindle that allows it to achieve higher accuracy and repeatability than standard mechanical systems. The machine can be set up to perform single-pass or multiple-pass lapping operations, with speeds from 0 to 250 RPM. UH-I-6200A is also outfitted with a standard oil-retention system that reduces the risk of contamination and enables it to produce smoother and more consistent wafer finish. The unit also has a bubble-inspecting function for wafer flatness and a vacuum-suction machine for wafer-holding capability. YUHIDENSHI UH-I-6200A is designed for use in a modern production environment with fast set up times and minimal maintenance. It features a user-friendly, ergonomic control panel with intuitive software controls for setting and saving machine parameters. The tool is compatible with various types of coolants, making it suitable for multiple applications. UH-I-6200A grinding, lapping, and polishing asset is a reliable and capable machine for achieving high quality, repeatable processing of large quantities of ultra-thin wafers. It is capable of performing precise abrading, creating even surface finish, and providing good flatness characteristics, and is well suited to a variety of grinding, lapping, and polishing applications.