Used ZIERSCH / BALTRUSCH FS 2560 #9086187 for sale

ZIERSCH / BALTRUSCH FS 2560 is an advanced wafer grinding, lapping, and polishing equipment designed to produce high-quality, precision surfaces on silicon and compound semiconductor wafers. This system combines the accuracy of precision grinding with the superior finish and control of single-side lapping, providing submicron-level flatness and smoothness to the wafer surfaces. ZIERSCH FS 2560 offers a wide range of features, including advanced computer-controlled grinding, lapping, and polishing; variable speed drives for precise control of stirrer, wheel RPM, and stroke length; 12-position rotating table for maximum sample capacity; closed loop force control to adjust for grinding pressure adjustment; and advanced diagnostics and error handling capabilities. The unit also includes an advanced post-processing machine, which employs a special optical detection tool to monitor the finish of the wafer. BALTRUSCH FS 2560 is flexible and can be configured for a variety of silicon and compound semiconductor wafer grinding, lapping, and polishing applications. The FS 2560s work table is driven by a torque motor and runs at variable speeds to adjust for the nature of the material being processed, while the rotational table maintains uniform wafer motion and allows for critical machining operations such as grinding and polishing. The motor is controlled by easy-to-operate touch pads and a SmartCab console, which provide simple and efficient control over the grinding functions. The motor is also equipped with a frequency control, which ensures smooth running and optimal cutting results. FS 2560's grinding heads are capable of providing precision flatness and surface smoothness. The grinding heads feature diamond pins and a spindle drive with an adjustable speed of up to 100 RPM. A special profile wheel is used for profile grinding and the coolant asset ensures a constant and even flow of coolant onto the wafer. The model also includes an advanced polishing equipment, which features superior surface finish in the submicron range, while providing the flexibility to work with a variety of materials. ZIERSCH / BALTRUSCH FS 2560 also includes an advanced safety system, which features two separate safety sensors and a fail-safe lock to ensure operator safety. The unit is certified to meet professional safety standards and is designed for long-term operation. Additionally, ZIERSCH FS 2560 features a full range of service options and maintenance contracts, which are available to ensure the machine is always running at optimal efficiency. Overall, BALTRUSCH FS 2560 is a powerful and reliable wafer grinding, lapping, and polishing tool, offering unsurpassed precision and accuracy in silicon and compound semiconductor wafer production. The advanced design and user-friendly features provide maximum efficiency, accuracy, and safety, making the asset ideal for any demanding wafer grinding, lapping, and polishing applications.