Used ZIERSCH / BALTRUSCH FS STARLINE 500 E #9237774 for sale

ZIERSCH / BALTRUSCH FS STARLINE 500 E is a wafer grinding, lapping, and polishing equipment. This system is designed for the efficient production of high-precision and high-quality crystalline wafers in the semiconductor industry. This unit offers a wide range of capabilities, including grinding with a wide range of abrasives, lapping, and polishing. ZIERSCH FS STARLINE 500 E utilizes various grinding technologies such as electrochemical grinding (ECG) and wet chemical grinding to provide a superior grinding process for complex geometries. It features grinding spindles with advanced hydrostatic bearings to produce high-precision results, while the grinding surfaces are successively coated with diamond grinding tools for efficient and effective grinding of ultra-hard materials. In the lapping process, BALTRUSCH FS STARLINE 500 E utilizes various automated technologies to produce superior wafers with repeatable and accurate results. It also ensures wafer edge profiles are developed to a tight tolerance and exceptional surface finish, while also utilizing specific abrasive slurry for a streamlined wafer lapping process. In addition, the machine is also equipped with automated wafer positioning for in-process wafer inspection and analysis. FS STARLINE 500 E also features a polishing tool to further refine the wafer surface. This asset offers the highest accuracy within the shortest duration thanks to advancements such as Plasma Enhanced Chemical Mechanical Polishing (PECMP) and Atomic Layer Deposition (ALD). It also features a multi-axis robotic arm that can perform complex polishing operations such as plane profiling, hole profiling, edge beveling, and multidimensional contouring. Additionally, ZIERSCH / BALTRUSCH FS STARLINE 500 E provides integration capabilities with other manufacturing systems and support for software-based process optimization, automation, and analysis. This model features the most advanced safety features to ensure personnel safety at all times. These features include a safety fence integrated within the machine interface, as well as safety interlocks and a fault detection equipment that monitors all process parameters. In conclusion, ZIERSCH FS STARLINE 500 E is a state-of-the-art wafer grinding, lapping, and polishing system, offering the latest in abrasive technology, automated process control, and safety features. This unit is designed to produce high-precision and high-quality crystalline wafers at the highest efficiency and highest quality.