Used ZIERSCH / BALTRUSCH URS 751 #9066960 for sale

ZIERSCH / BALTRUSCH URS 751
ID: 9066960
Vintage: 1980
Cylindrical grinding machine 1980 vintage.
ZIERSCH / BALTRUSCH URS 751 is a highly advanced wafer grinding, lapping and polishing equipment used in the production of semiconductor wafers. It is capable of precisely grinding, lapping and polishing wafers of various sizes and thicknesses in a single-chuck processing or double-skew processing. The system is equipped with a five-axis CNC machine for the exact positioning of the wafers and a powerful grinding motor providing a high rotation speed of up to 24,000 RPM. This allows the unit to be used for very thin wafers down to just 10microns. The machine is equipped with a servo-motors that enable the speed to be adjusted in a range from 100 to 2,400 RPM, depending on the wafer size, thickness, type of grinding and polishing that needs to be done. ZIERSCH URS 751 tool also features a powerful vacuum asset for reliable and exact wafer transportation. The vacuum model can be used to lift and securely hold wafers during grinding and polishing operations. It also ensures a secure and perfect loading and unloading of the wafers to maintain a longer operating lifetime. A tool changer integrated in the machine enables the easy and fast exchange of up to eight grinding, lapping and polishing tools, so that the equipment can switch quickly between different operations. The system also features a liquid cooling unit for the grinding, lapping and polishing processes. The machine is designed in accordance with safety guidelines and provides an area of safety protection for operators. In addition, the machine comes with a software package that allows for programmable processing features. Additionally, it features a touch screen display for easy and accurate setup of grinding, lapping and polishing processes. The software is user-friendly, enabling a wide range of parameters to be adjusted to ensure the highest possible quality standards and accuracy. In conclusion, BALTRUSCH URS 751 is a highly advanced wafer grinding, lapping and polishing tool designed to offer reliable operation and precise results. It is equipped with a powerful and advanced CNC machine, an adjustable motor speed, a tool changer, a vacuum asset, a liquid cooling model and a user-friendly software package, ideal for a wide range of applications.
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