Used ASYST 9750-2000-00 #9171661 for sale

ASYST 9750-2000-00 Wafer Handler is a high-precision, fully-automated wafer loading and unloading solution for semiconductor fabrication environments. The handler is a flexible and efficient solution for die-level test, characterization, and packaging. It supports a wide range of wafer substrates from 4" to 8" and provides accurate, repeatable, and reliable wafer handling capabilities. The handler is equipped with two linear stages - one for X-axis motion and the other for Y-axis motion - in order to provide two degrees of freedom and programmable control of wafer positioning. The motors are driven by an advanced direct-drive servo control equipment that allows for extremely precise motion and minimal backlash. It features encoder-based closed-loop motion control, providing for superior repeatable accuracy. The system operates over a wide range of temperatures and is robust enough to survive in tough semiconductor fabrication environments. 9750-2000-00 Wafer Handler offers several different loading and unloading configurations, which are supported by its front-loading and front-unloading wafer transport systems. These include a door-lift cassette loader, a fork-lift loader, a front-separated cassette loader, and a front-separated quad track loader. The unit also features integrated die-level verification technology that allows for precise positioning and alignment of wafers, and an integrated vision machine that enables edge detection and barcode reading. This enables further process automation. ASYST 9750-2000-00 Wafer Handler is equipped with a robust controller that provides recipe-based control of the entire tool and facilitates fast wafer loading and unloading. It can be integrated with factory automation systems and provides advanced software tools for tracking and analyzing asset performance data. Additionally, the handler is designed with an optional vacuum wafer attach capability, allowing for safe and fast wafer attachment. Overall, 9750-2000-00 Wafer Handler is a robust and reliable solution for accurately loading and unloading die-level test, characterization, and packaging applications. It supports a wide variety of wafer diameters, integrates vision systems for wafer edge detection and barcode reading, and offers integrated die-level verification technology. It also includes a user-friendly controller and fast wafer loading and unloading capabilities.