Used ASYST LPO 2200 #9138592 for sale
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ASYST LPO 2200 wafer handler is a computing device designed to control and automate the loading and unloading of wafers and substrates in the semiconductor industry. It utilizes advanced sensing and control technology to safely manage and handle wafers quickly and accurately. LPO 2200 features two independent wafer robots, each being capable of handling wafer sizes from 200mm that can be loaded with cassettes, French boats, or any other wafer handling equipment. It uses an advanced image recognition system which uses an array of high-resolution cameras to verify the quality and accuracy of all wafers before they are robotically loaded onto the prober. The advanced control unit is designed to maximize accuracy and minimize errors while performing all wafer handling movements. ASYST LPO 2200 is integrated with an automated material handling machine and an enhanced user interface that provides full control over the wafer handling process. It can be used to load wafers directly from cassettes to the prober or to store wafers in an on-board inventory, allowing repeated virtual or realize utilization of the same wafers in the entire process. It is also equipped with full temperature probing and independent thermal control that allows for precise readouts and manipulations of wafers' temperature. For added security and accuracy, LPO 2200 features a powerful self-diagnostic tool that automatically instructs the user on any wafer handling errors that may occur. This allows the operator to make the needed adjustments to ensure a seamless handling process. Additionally, optional cleaning systems can be used to enhance wafer cleanliness for more consequent wafer handling quality. In summary, ASYST LPO 2200 is a sophisticated wafer handler designed to provide accurate and efficient loading and unloading of wafers. With its advanced image recognition asset, built-in fault detection, and optional cleaning model, LPO 2200 ensures a reliable and safe wafer handling process for any application.
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