Used ASYST LPT 2200 #9016891 for sale

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Manufacturer
ASYST
Model
LPT 2200
ID: 9016891
Wafer Size: 8"
SMIF Loader, 8" Asyst LPT-2200 bolt-on SMIF load-port Part no. 9700-6232-01 Right-hand orientation Vertical movement 2001 vintage.
ASYST LPT 2200 is an advanced automated wafer handler designed to provide consistent and reliable material handling and management that are critical to Semiconductor process control. This device can accommodate a wide range of wafer sizes, from 100mm to 200mm, and can move up to 200 carriers a minute with high speed, accuracy and efficiency. ASYST LPT2200 utilizes an easy-to-use graphical user interface that provides full visibility and control of the wafer tracking and deposition process, along with information logging and reporting. The GUI also includes a virtual LCD display to show real-time monitoring of equipment status and events, as well as transport control parameters, program settings, and job settings. Additionally, the device provides the capability to save, load, and compare equipment settings using PC based monitoring/maintenancesoftware. LPT 2200 is constructed with a robust, ergonomic design that provides low vibration, low noise, and minimal air consumption. The construction of the handler enables modular internal operations, allowing for easy customization, expansion and integration into system environments. The device also includes several safety features, such as a lockable lid, non-destructive touchscreen, and vision monitoring. In addition, LPT2200 features several features to improve process control and yield, including a 2-axis wafer positioning unit that is accurate to a millionth of an inch, a high speed computer controlled pick and place machine that can move up to 200 carriers/minute, and an on-board wafer transfer tool. The device also comes with a library of carousel configurations to conveniently maintain cleanliness in the handling area. ASYST LPT 2200 is capable of handling up to 200 carriers per minute, making it an ideal solution for high-volume production environments. The device is also capable of handling multiple wafer sizes and is equipped with several features that enable scalability, flexibility, and customization. In addition, the device is highly reliable and efficient and is capable of providing reliable operation and low maintenance costs.
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