Used ASYST LPT 2200 #9036272 for sale

ASYST LPT 2200 is a piece of advanced wafer handling equipment. It is designed to load, unload and measure wafers as part of a wider production process. It processes wafers on an automated and continuous basis, making it applicable to many different types of semiconductor production. The design of ASYST LPT2200 is based on a patented AccuPick™ equipment which uses a suction tweezer to transfer patterned or unpatterned wafers from holding cassettes to the machine's handling chamber. LPT 2200 is capable of efficiently accommodating a wide variety of wafer geometries, thicknesses, and surface features. The AccuPick™ system allows wafers to be accurately transferred with minimal handling damage and minimal manual interaction. LPT2200 is equipped with an integrated measurement unit that ensures high accuracy of the end-product. It utilizes a precision measurement machine and a door-mounted camera to measure the limited physical parameters of wafers such as thickness, flatness, reflectance and topographical surface characteristics. The tool also has the capability to handle specialized wafers such as sapphire, silicon-on-glass, and substrates with an aluminum nitride layer. ASYST LPT 2200 is constructed from a precision stainless steel frame that conforms to the tight tolerances and requirements of semiconductor production processes. It comes with numerous safety and protection measures including emergency door release and emergency stop functions, along with full automation for loading and unloading wafers. ASYST LPT2200 is designed for use in a variety of different applications such as test wafer production, packaging of wafers for laboratories and consumer markets, as well as metrology and inspection processes. The machine is available in various design configurations to suit the exact requirements of a wide range of customers. Overall, LPT 2200 is a reliable and highly efficient piece of wafer handling equipment. It is capable of precision handling, measurement and inspection of a wide variety of wafer geometries and surface features. This makes it a viable option for a range of semiconductor production applications.