Used ASYST / PST SPARTAN #293652724 for sale

ASYST / PST SPARTAN is a wafer handler designed for use in semiconductor fabrication operations. It is equipped with a range of automated functions for loading and unloading, cleaning, aligning and even cutting of wafers. The device can be used in manual, semi-automatic and fully automated modes. In manual mode, the handler carrier arm can be moved to any position within its workspace. The wafer carriers are locked into the support plate, and the equipment will automatically detect and orient the wafer relative to the assembly surface. It is designed to support large format (300mm), small format (50mm) and ceramic (Ceramic materials) wafers. The system can load and unload up to three wafers at a time using a special high speed loader and unloader. The loaders and unloaders can be automated to optimize throughput while maintaining wafer orientation and spacing. The handler also features a wafer clean station that uses ultrasonic and chemical cleaning processes to remove surface contaminants from wafers prior to handling. A hydrocarbon vacuum wand is employed to remove particles from wafer surfaces. The wafers are then passed through a nitrogen plasma cleaner to further purify the surfaces for best handling results. Other operations available include laser image recognition for accurate alignment of wafers in the handler, blade cutter for cutting notches into standard and custom shapes, and pressure cams to apply pressure to wafers. PST SPARTAN wafer handler is designed with a highly reliable and robust design to ensure reliable operation. It is capable of accommodating up to 150 wafers on its support plate. It also includes a 4 Step Safety Lock unit to limit possible wafer handling errors. The wafer handler also includes reports and job files to be either printed or uploaded to a computer for tracking and analysis. In summary, ASYST SPARTAN is an advanced wafer handler designed for high throughput production operations. It is equipped with a range of automated functions for loading and unloading, cleaning, aligning and even cutting of wafers. The device is also configured with a 4-Step Safety Lock machine, and includes a wafer clean station, laser image recognition tool, blade cutter, and pressure cams. The device is capable of supporting large format (300mm), small format (50mm) and ceramic (Ceramic materials) wafers and incorporates reliable safety features for its use in the most demanding semiconductor fabrication environments.