Used ASYST SMIF-300FL #9287742 for sale

ASYST SMIF-300FL Wafer Handler is a unique and powerful semiconductor device assembly and manufacturing equipment. This platform is designed to provide high-speed, precise, and flexible handling and inspection of various semiconductor packages. ASYST SMIF 300FL Wafer Handler can handle a variety of packages, including Flat, Quad Flat Pack (QFP), Flip-chip, Grid Array, no-lead CSP, and even wafer-level Chip-Scale Packaging (CSP). It can also be used to handle specialty packages and other structures. SMIF 300 FL Wafer Handler enables the process to be quickly and accurately completed. It provides a high speed, compact, low-temperature, and environmentally friendly solution. Its unique design includes a precision-controlled vacuum transport system that moves the packages in a very precise, coordinated, and repeatable manner. It also includes a camera unit that uses a high-definition, high-speed RGB sensor that can capture up to and beyond 1000 frames per second. This enables the fast and precise inspection of packages. This wafer handler offers an open and flexible platform that facilitates the integration of laser assembly and laser soldering. SMIF 300FL supports a wide range of processes, including pick-and-place, laser assembly, laser soldering, die conduct inspection, die bond and wire tests, long-reach paste-dispensing, underfill dispensing, and no-lead CSP processing. The wafer handler also provides efficient fault location, identification, and repair, as well as full testing of optical chips and packages. ASYST SMIF 300 FL Wafer Handler has a sophisticated control machine that is easy to use and provides an extensive range of programming and diagnostic tools. Setup time is minimal, and the device allows for flexibility and the ability to quickly optimize processes. The wafer handler also offers a selection of integrated handling and detection features, such as die recognition, sort to type and diversion, and defect recognition. Overall, SMIF-300FL Wafer Handler is a reliable and efficient device assembly and manufacturing tool that provides quick, accurate, and flexible handling and inspection of packages. This asset is well suited for applications in semiconductor industry, such as die bonders, die attach machines, laser assembly machines, laser soldering machines, and many other related devices.