Used ASYST WIS #9301462 for sale

ASYST WIS is an advanced robotic wafer handler designed for harsh environments. It is designed to streamline the automation of semiconductor wafer processing and ensure precision control and high throughput rates. The equipment is capable of bonding robotic wafers to the substrate surface with speed and accuracy. WIS provides maximum end-effector access owing to its unique design, and it also provides user-friendly robot control through an intuitive touchscreen interface. The system can accommodate large wafers up to 12-inches, and has one or two wafer locations per tool. It is conveniently mounted on a movable base to ensure easy access and maintenance. ASYST WIS is equipped with a wealth of advanced features and options, including a high-speed wafer pick-and-place unit, vision machine for wafer identification, contamination controller, and temperature and humidity sensors. It also includes a End-of-Arm-Tooling (EOAT) tool that mounts wafer carriers, frames, carriages and other tooling mechanisms to the robot manipulator. WIS includes a URSA Vision Asset that provides the robot with the ability to identify, measure, and orient wafers for efficient handling. ASYST WIS model is integrated with existing automation tools and equipment to expand productivity and reduce downtime. With its modular and flexible structure, it provides a host of options to upgrade and expand production capabilities and maintain a low cost of operation. The equipment also comes with an optional integrated Autotech edge-remaining-chip-on-wafer (ECOWAS) system that can automatically remove excess wafer material. WIS is designed with ease of maintenance in mind. It is made of corrosion-resistant components with many points of access for quick inspection and repair. It is also built with the latest safety devices to offer safer operation for both the robot and users. ASYST offers a variety of customized solutions and offers technical assistance and support services. ASYST WIS is an ideal solution for efficiently handling and bonding wafers in a range of industries such as semiconductor, consumer electronics, and aerospace. It is an excellent cost-effective automation tool that can easily integrate with existing systems to increase production efficiency and throughput.