Used BAUMANN WHO RvO #9091901 for sale

Manufacturer
BAUMANN
Model
WHO RvO
ID: 9091901
Wafer-handling line for oxidation furnace Long flat, half pitch, (5) tubes Output: up to 4,000 Wafer/hr Breakage rate:  0.1% Wafer formats: 156 x 156 mm Loading type: Front-to-Back (FTB) 6-Axis robot technology Integrated machine data logging (MDL).
BAUMANN WHO RvO is an advanced wafer handler designed for seamless integration into automated wafer processing systems. It is built to handle 300-mm diameter wafers with a 12-inch wafer diameter. The unit is a highly advanced and precise wafer handling equipment and includes an adjustable tilt base unit with a total height of 101mm. The wafer handling system includes a robot arm with double-axis angle control with full trajectory control with up to 20 motions per cycle. It also includes a wafer clutch mount to ensure proper alignment of the wafer during the handling process. The unit is equipped with a unique vision machine that can detect and recognize up to 30 wafers and automatically adjust the tilt and angle of the robot arm for precise wafer handling. WHO RvO tool is equipped with a wafer sizever, reject unit, and loader. The loader is made with a 3D cylindrical platform that pushes the wafer into place with a clamp and holds it in place during the wafer handling process. The asset also features a wafer aligner that carefully organizations the wafers to ensure batch continuity. The wafer sizever allows for precise slicing of wafers into the desired textures and shape. The reject unit is adjusted to avoid risking contamination as it discards any unqualified wafers without causing further contamination. BAUMANN WHO RvO is designed for ease of use and maintenance. The model is able to recognize and adapt to any malfunctions that may arise during the wafer handling process to reduce downtime and risk of damage to any other parts of the machinery. The equipment also includes a REMOTE-Exchange System (RES) that allows for efficient remote diagnosis and servicing of the unit if technical problems arise. In conclusion, WHO RvO is a highly advanced wafer handling machine designed for accurate, reliable, and consistent handling of 300-mm diameter wafers in automated wafer processing systems. Its unique vision tool, adjustable tilt base, robot arm with double-axis angle control, and wafer sizever, reject unit, and loader make it the perfect choice for efficient and precise wafer processing.
There are no reviews yet