Used BROOKS AUTOMATION / JENOPTIK Ergospeed II #9134144 for sale

BROOKS AUTOMATION / JENOPTIK Ergospeed II Wafer Handler is a high-performance robot designed for wet and dry processing of semiconductor wafers used in the production of integrated circuits and other electronic components. Utilizing advanced robotics technology, JENOPTIK Ergospeed II is designed to interface with most wet or dry process systems to provide efficient and accurate handling and manipulation of wafer cassettes. BROOKS AUTOMATION Ergospeed II is equipped with a two-arm robotic system, each arm incorporating a separate vacuum boule-holder arm for holding and transferring cassettes from one station to another. The boule-holder arms are equipped with an adjustable-height platform which lets the wafer handler reach into different positions and orientations. The integrated gripper technology enables the robot to securely hold the wafer cassette in place during transport and prevent 'slip-back' during loading and unloading. Additional features of Ergospeed II include a wafer loader capable of handling pressures up to 100g, a precision piezo-driven gripper system, and a closed loop stepper motor for accurate positioning of the robot's arms. The high-speed and low inertia motor drives provide exceptional rapid response and allow for accurate and efficient picking and placing of delicate and delicate semi-conductor and manufacturing components. BROOKS AUTOMATION / JENOPTIK Ergospeed II wafer handler is also designed with a user-friendly graphical user interface (GUI) which allows users to configure the robot and move it quickly and safely to the desired position. The robot can also be operated remotely for multiple device and process system integration. It also supports Windows, Linux, and DOS operating systems and is compliant with safety standards for Semiconductor Fabs, Cleanrooms, and industrial environments. JENOPTIK Ergospeed II wafer handler is suitable for a variety of semiconductor wafer handling applications, including semiconductorbonding, depletion grinding of silicon, lithography alignment, fabrication, and other device processing tasks. It features reliable operation, efficiency, safety, and accuracy for wafer processing.