Used DENSO VM-6070DM #9121552 for sale

DENSO VM-6070DM is a high-precision, automated wafer handler designed with the latest robotic technologies. It features an advanced vision equipment and a unique multi-axis robot that provides precise wafer handling and manipulation. The robot is capable of handling and gripping a variety of wafer sizes and shapes, including round, rectangular, and hexagonal. The system is equipped with a state-of-the-art touch sensing vision unit, which enables a high level of accuracy in positioning and gripping the wafer. The vision machine is equipped with 2D and 3D color measuring capabilities, allowing for more precise wafer detection and handling. A variety of markers can also be used for improved positioning accuracy. The tool ensures a reliable, repeatable wafer handling process with its proprietary control asset. The model is designed to perform multiple pick and place operations with its multi-axis robot and offers a range of functions, such as pneumatic and vacuum control, vacuum maintain and release, and recipe loading. The robot can also perform high speed operations such as alignment, re-orientation, and wafer transfer. The wafer handler also features high speed wafer sorting and off-loading capabilities, enabling fast and precise wafer identification and sorting. Its vision equipment provides time saving features that enable faster sorting times. With its simple programming functions, users can easily create customized programs for automated wafer handling. Overall, VM-6070DM is a powerful wafer handler designed to offer advanced automation capabilities. Its vision system, multi-axis robot, and enhanced control unit provide accurate and reliable wafer handling operations, enabling faster and more efficient production processes.