Used F-ONE CAL-1A01-Z30R35 #9111141 for sale

F-ONE CAL-1A01-Z30R35 is a wafer handler designed to accurately handle up to 200mm (8-inch) diameter wafers on 8mm (1/3 inch) hubbed carriers. It features an automated, modular design with integrated online tutorials. The main body of the wafer handler is composed of a module base and a module body. The module base is a cast aluminum base with an EMI-shielded interior. On top of the base is the module body, which is also aluminum and supports the wafer loading flange and vacuum pickup port. All of the internal parts and wafer-handling mechanisms sit inside the module body. The wafer handler has six system modules: Vacuum, Vacuum Detection, Gas Purge, Motion Control, Wafer Skew, and A/V Module. The Vacuum module consists of a vacuum pickup port that can be installed to support up to 25 different wafer sizes. It also includes an integrated vacuum control system to provide accurate control. The Vacuum Detection module is used to detect the presence of a wafer on the handler using a variety of methods such as optical, capacitive, thermal, or acoustic. The Gas Purge module can be used to provide a clean atmospheric environment for the wafer handing process and is customizable to different process recipes. The Motion Control module is used to control the wafer handlers movements as well as the speed and acceleration. It also includes a computer numerical control (CNC) interface that is used to program custom trajectories. The Wafer Skew module is used to ensure that wafers are loaded into the wafer handler in the proper position. It uses detection technology to detect the wafers position as it enters the handler and can be used to adjust it if necessary. Finally, the A/V module is used for communication between a host computer and other components. This lets the user monitor and control the performance of the wafer handler from outside the machine. In conclusion, CAL-1A01-Z30R35 is a wafer handler designed to accurately handle up to 200mm (8-inch) diameter wafers on 8mm (1/3 inch) hubbed carriers. It features an automated, modular design with six system modules that are designed to provide precise control and accuracy while handling wafers. The device can be used for a variety of applications and is easily customized for various process recipes.