Used FANUC Robodrill Alpha-D21MiB5 #9240274 for sale

FANUC Robodrill Alpha-D21MiB5 is a five-axis, high-speed, high-precision wafer handler designed for use in semiconductor assembly and die bonding operations. It provides a fast, reliable method for accurately handling wafers during soldering, attaching components, and other related tasks. This equipment utilizes advanced robotics and automation technology to ensure high performance and consistent results. The Alpha-D21MiB5 has a powerful servomotor-driven linear movement system, which enables it to rapidly navigate within its working area of 2100mm in the X, Y and Z axes with a maximum speed of 30m/min. This unit also incorporates a C-axis rotary axis that can be configured for various applications such as a tilt axis, a rotation axis, or a dough-shear movement. It is equipped with a six-fold vision machine which provides fast and accurate image acquisition and analysis for wafer recognition and edge detection. The Alpha-D21MiB5 is equipped with a vacuum nozzle and clamp arm to securely handle wafers of up to 450mm in diameter. Its adjustable Operation Speed Control (OSC) allows for highly precise motion control and manipulation of the wafers. This provides a smooth operation with minimal run-out and optimum positional accuracy. Additionally, the tool features an RCS interface for easy integration into existing production lines or other compatible devices. For added safety, the Alpha-D21MiB5 has a programmable emergency stop, air connection switch, and various external functions such as E-stop input, safety stop, and repeatable presetting. The included multilingual operation panel allows for easy and intuitive operation. The unit also offers a variety of functions to enhance productivity, including a 16-way tool changer, dry and wet vacuum exchanger, multi-tasking program function, and a job record function. Robodrill Alpha-D21MiB5 is a powerful and highly capable tool for wafer manipulation, offering a multitude of features that make it a great choice for automated assembly and die bonding operations. Its advanced robotic and automation technology, coupled with its adjustable Operation Speed Control and other features, make it a reliable option for high-speed, high-precision handling and processing of wafers.