Used GENERAL DYNAMICS R8000B #9281612 for sale

GENERAL DYNAMICS R8000B
ID: 9281612
System.
GENERAL DYNAMICS R8000B Wafer Handler is an automated equipment designed for the manipulation and transfer of substrates in the semiconductor industry. This state-of-the-art system is capable of handling wafer sizes up to 8 inch in diameter and can process up to 20 wafers per hour. R8000B is equipped with an intuitive graphical user interface (GUI) which allows users to easily and quickly select a processing type for each wafer. Furthermore, the GUI provides real-time collection and display of processing parameters from the unit, enabling an operator to quickly identify and modify any parameters needed to adjust production flow. The machine is also equipped with a unique patented pick and place feature which allows a wafer to be placed onto a number of substrates without the need for manual intervention. GENERAL DYNAMICS R8000B Wafer Handler has been designed to operate in both cleanroom and non-cleanroom environments. Its advanced contamination control tool features a three-stage air filtration unit, which utilizes both HEPA and ULPA filtration techniques in addition to an ozone scrubber to ensure all effluents are safely and efficiently removed from the asset. The model also utilizes a low-noise, low-vibration motor to minimize any EMI interference which could compromise process flow. R8000B Wafer Handler boasts several innovative and cost-effective features, which allow for efficient, accurate, and repeatable processing of substrates. It offers a precise wafer centering mechanism which precisely positions and evenly adjusts wafers for better process control and compliance with OEM specifications. Furthermore, the built-in conveyor belt is designed to reduce handling time and provide gentle membrane adherence during transfer, while the advanced motor driver ensures smooth operation and minimized distortion. In conclusion, GENERAL DYNAMICS R8000B Wafer Handler is a reliable and efficient equipment for handling and transferring substrates in the semiconductor industry. Its advanced features and intuitive control system make it highly suitable for any process which requires handling of wafer sizes up to 8 inches in diameter. Additionally, the unit's advanced contamination control, conveyor belt, and motor driver make it a low-maintenance solution which allows users to enjoy a consistently high-level of performance and accuracy.
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