Used INTEGRATED DYNAMICS ENGINEERING SPA-300 #9007852 for sale

INTEGRATED DYNAMICS ENGINEERING SPA-300 is a high-performance equipment for sensitive material handling in vacuum and ultra high vacuum environments. It is designed for fully-customizable configurations with a built-in wafer handling capability for applications in development, prototyping, and wafer thinning. This system is capable of safely and securely manipulating small substrate wafers in conditions ranging from low vacuum to near-vacuum. It is also ideal for research applications that require precise handling of wafers without contaminating the environment. SPA-300 operates using a dual-axis, fully stepper-motor driven motion unit, offering users full control over both x- and y-axis travel. The motion machine provides smooth and precise positioning of wafer substrates with a minimum repetition accuracy of 0.04 mm. The unit features soft start/stop control and high dynamic jerk control to further reduce the chance of any wafer damage. Additionally, an anti-collision mechanism is built into the tool to protect the substrate from accidental impacts while in motion. At the heart of INTEGRATED DYNAMICS ENGINEERING SPA-300 is an advanced vacuum feedback asset that uses external sensors to monitor vacuum levels within the model. The equipment can detect and monitor the presence of a vacuum down to 10-5 Torr, and control the wafer handling speed and motion accordingly. This system ensures that the vacuum levels remain in the set range, and that the wafer devices are handled with the utmost precision. SPA-300 is also engineered with the capacity for vacuum process integration. This includes an automated vacuum sensor calibration unit, allowing users to set the optimal vacuum level for each individual process step. Furthermore, the machine can be equipped with an additional dielectric pump, which further supports its vacuum requirements. Finally, INTEGRATED DYNAMICS ENGINEERING SPA-300 is equipped with multiple safety features to protect the wafers. These safety features include a built-in emergency air break, a fully-enclosed safety interlock switch, and redundant emergency stop buttons. All these features ensure that even if an accident occurs, all the wafers remain safe and secure. Overall, SPA-300 is an extremely advanced and reliable wafer handling tool for use in complex vacuum processes. It provides unprecedented safety and control over wafer handling, as well as repeatable and accurate results. With its unique design and intuitive functionality, this asset can help users achieve their desired results for cutting-edge applications.