Used MURATA CD200 #9039649 for sale

MURATA CD200 Wafer Handler is an automated sub-micron handling and metrology system for semiconductor and flat panel production applications. CD200 is designed to provide the highest throughput and most accurate results with the shortest cycle time. It is a compact, single-axis system which can be easily integrated into an automated manufacturing line. MURATA CD200 is equipped with a high-resolution digital camera and advanced image processing to identify wafer patterns, defects and edge characteristics. The robotic arm can move very accurately in the three-dimensional space to pick up, handle and place wafers with a precision of less than 100 nanometers. CD200 is also designed with high-precision alignment capability for wafer inspection and sorting. MURATA CD200 can perform multiple wafer handling tasks quickly and accurately. These tasks include wafer calibrations, edge inspections, wafer sorting, and edge de-burring. CD200 integrates with other system components such as precision alignment and texture mapping to provide accurate results. It can also be used for wafer-level testing such as stress mapping, dielectric and metal sheet resistance. MURATA CD200 comes with an integrated Vacuum Chucking Station for wafer gripping and handling. The Vacuum Chucking Station is equipped with an anti-drop safety device to ensure safety during loading and unloading operations. CD200 also includes a tool changer to allow for quick and easy exchange of wafer handling parts. MURATA CD200 is designed to provide consistent results across all wafer sizes, from small to large. The unique optical metrology and sorting capabilities of CD200 make it ideal for advanced wafer production. Its wide range of operations, precision and repeatability, coupled with its high speed and accuracy make it perfect for wafer handling applications.