Used NISON 1800E-55G-1 #9383257 for sale

NISON 1800E-55G-1 wafer handler is an automated equipment designed for efficient and reliable wafer handling of 150mm substrates. The unit features a unique linear-transport scheme that is extremely responsive and accurate, providing unparalleled speed and throughput capabilities. The system includes an integrated XY scanner for precise alignment and positioning of the wafer, and a custom gripper designed for smooth and secure loading and unloading of semiconductor substrates. The wafer handler is capable of handling up to 55 wafers per tray, with a total capacity of up to 1800 wafers. This high capacity enables 1800E-55G-1 handler to maximize throughput in a wide range of applications, including test, inspect, measure, or process tasks. The unit is additionally equipped with an efficient, low-noise dual-axis air pressure mechanism for precise placement and alignment of wafers. NISON 1800E-55G-1 wafer handler is designed for fast and flexible operations. It offers a full range of drive and attachment configurations that allow for easy integration into any existing unit. This includes high-speed wafer transport, substrate tracking, and alignment, as well as a vacuum-type subsystem that enables precise and repeatable product handling. Additionally, the machine's integrated safety interlock ensures that wafers are always handled in accordance with safety regulations. 1800E-55G-1 wafer handler is designed to meet a wide range of industry standards for safety and reliability. It is equipped with a variety of fail-safe features, including clear alarm indications and emergency stop buttons, as well as external air filters for enhanced dust and particle protection. These features ensure that the wafer handler meets the highest safety and environmental requirements. NISON 1800E-55G-1 wafer handler is an excellent choice for semiconductor fabrication as well as test, inspect, measure, or process tasks. Its adaptable and reliable design offers impressive performance capabilities, making it an ideal solution for a variety of applications, including photolithography, flip-chip bonding, thin-film processing, and much more.