Used PRI / EQUIPE PRE 3190 #9140505 for sale

PRI / EQUIPE PRE 3190
Manufacturer
PRI / EQUIPE
Model
PRE 3190
ID: 9140505
Wafer Size: 8"
Wafer pre-aligner, 8".
PRI / EQUIPE PRE 3190 is a leading wafer handler for semiconductor applications. It is a compact, top-loading, and high-performance robotic wafer handler designed for efficient semiconductor device testing, assembly, and production. PRI 3190 operator-friendly platform features a precise wafer release equipment capable of handling up to 6 wafers with a 250-millimeter wafer diameter. It is unique among its competitors as it can be controlled manually or automatically from the host system using a 4-state cycle. EQUIPE 3190 is well-suited to handle all varieties of semiconductor devices with different physical densities, such as DRAM, ROM, logic, gate-array, and ASIC. The handler is constructed with robot mechanism that permits very fast placement and exchange of wafer carriers. It features a an ultimate accuracy of ±0.01 millimeters in picking wafers from the cassette. The handler's design also allows the user to vary the gripping force applied to the wafer according to the size and weight of the device. PRI / EQUIPE 3190 offers an ALL-IN-ONE server solution that duplicates the operating characteristics of an entire testing unit with only one hardware. This server solution eliminates unnecessary hardware and establishes a safe, reliable, and highly efficient machine for wafer testing, assembly, and production. PRI 3190 is also designed to be easy to use and highly reliable. The interface intuitive user interface allows the user to communicate with the handler using simple commands. It allows the user to quickly set the process parameters and accurately monitor the loading and unloading of wafers from the cassette. The robust design of the handler makes it reliable and capable of withstanding all manufacturing conditions, from dust to temperature and humidity fluctuations. EQUIPE 3190 wafer handler is an extremely reliable, fast-operating device for optimal production in semiconductor device testing, assembly, and production. It is able to handle different varieties of wafers with precision and accuracy and is housed in a compact top-loading design that allows easy operation. The ALL-IN-ONE server solution eliminates unnecessary hardware and the user-friendly interface allows users to quickly set process parameters and monitor the loading and unloading of wafers.
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