Used RECIF SPP8 #9050094 for sale

RECIF SPP8 is the latest wafer handler model from RECIF Technologies. This wafer handler enables advanced, efficient and precise picking, alignment, and tracking of up to eight 2-inch (50mm) wafers. The area of the handler is 429 x 428 mm, and its dimensions are 1142mm (L) X 608mm (W) X 359mm (H). At the heart of SPP8 is an advanced 6-axis robotic mechanism. This mechanism is designed to handle wafers of various thicknesses. It includes a vision equipment, as well as a suction cup system that allows for precise alignment and handling of wafer frames. The vision unit contains two cameras and a lighting machine, as well as a vision processor to detect and verify wafer position. The suction cup is driven using a 3-phase stepper motor, and its position can be adjusted depending on the thickness of the wafer. Other features include an integrated process monitor, a digital control interface, and a software-driven user interface. The integrated process monitor registers critical parameters such as vacuum level and temperature history during each process. It also provides real-time monitoring of temperature, atmospheric pressure, vibration, current level, and frame thickness. The digital control interface enables fast and easy setup of wafer-handling parameters, as well as the parameters needed to control the robotic mechanism. It also provides real-time feedback to quickly modify and optimize wafer-handling parameters through an integrated online setup process. The user interface features an intuitive graphical user interface with a touch screen and intuitive menus. It is designed to enable quick and easy access to any feature or functionality within the process. It also allows the operator to quickly modify the parameters of the process being controlled. RECIF SPP8 is specifically designed for the semiconductor industry and is capable of handling up to 8 2-inch wafers per cycle. It is made of high-grade materials that enable it to handle extreme environmental conditions with superior performance. The combination of advanced robotics, dedicated vision and digital controls allows for accurate, precise, and reliable wafer-handling operations.