Used RORZE / YASKAWA RR741L15-411-120-1 #9232808 for sale

RORZE / YASKAWA RR741L15-411-120-1 is a versatile wafer handler suitable for use in die bonding, chip mounting, and other high-performance semiconductor processing applications. This particular model is configured with a 450-watt leading edge electrostatic chuck, a 1.2 meter long arm, and a total weight of 15 kilograms. It can handle up to 200mm wafers and has a maximum speed of 900mm/minute for the geometrical movement of the arm and handling tool. The features of this wafer handler include an integrated die bonder, vision systems, an integrated lift equipment, and optical centering. The integrated die bonder in this handler is designed to reduce the processing times and improves both accuracy and repeatability of bonding operations. The lift system is a combination of a rotating drum, electric actuator, and a grasping vacuum and can be used to lift the wafers off the chucks for easy manipulation. It also features a vision unit with a 0.03mm accuracy and repeatability, making it suitable for both fine alignment and precision placement applications. RORZE RR741L15-411-120-1 wafer handler has multiple built-in safety features, including a protective cover for the loader, two anti-static barriers, and a safety stop machine. It is powered by an integrated AC induction motor, and its interfaces include a serial I/O port for communication and an Ethernet port for remote control. Additionally, it supports multiple mounting modes and is compatible with a wide range of liquid dispensing equipment, making it suitable for a wide range of applications. In addition to having high-performance and excellent control precision, YASKAWA RR741L15-411-120-1 wafer handler is highly reliable and efficient. Its customizable options, robust safety features, and versatile mounting options make it a great choice for any high-performance semiconductor processing application.