Used SHINKO 3D80-001147-V3 #9169708 for sale

SHINKO 3D80-001147-V3 is a robotic wafer handler developed by the Japanese company SHINKO for industrial semiconductor fabrication. It is designed to quickly and precisely handle large wafers, as well as thin and small substrates. The V3 model is designed to handle wafer sizes up to 8 inches in diameter. 3D80-001147-V3 has a unique design which allows a "double-fingered" wafer grip. This double-fingered mechanism reduces the stress on the wafer, ensuring precise handling and preventing any damage. Its slim body has a lower rotation center that increases stability while allowing a much higher rotation speed up to 600 RPM. This makes SHINKO 3D80-001147-V3 suitable for high-speed automation. 3D80-001147-V3 is used for loading, unloading and transferring wafers both horizontally and vertically. It is equipped with two linear actuators, one for the x-axis and one for the y-axis. This allows for precise positioning of the wafer in relation to any work piece. The actuators use a combination of optical encoders which help to provide accurate position feedback. SHINKO 3D80-001147-V3 is made from hardened stainless steel and is electropolished for an exceptionally smooth surface. This makes it suitable for use in cleanroom environments. The unit is connected to the factory automation system by a serial RS-232 port for easy configuration of wafer size, material, thickness, and number of segments. In summary, 3D80-001147-V3 is a high-performance robotic wafer handler capable of picking, placing, and transferring wafers with precise control. Its slim design, double-fingered wafer grip, and high-speed rotation provide exceptional stability and maneuverability, while its hardened stainless steel body and RS-232 connection make it suitable for use in a wide range of automated industrial environments.