Used SHINKO BX80-070938-13 #293668742 for sale

SHINKO BX80-070938-13 is a semi-automatic wafer handler that is highly specialized for the transportation and handling of wafers. This particular model is used for 80mm wafers and is able to handle up to 300mm wafers. It is designed for 300mm wafer transfer and single wafer upending, and is a next-generation wafer handling solution suitable for thin wafers. BX80-070938-13 is equipped with a newly developed, highly precise three-dimensional mechanical stage that allows for stable transportation of 80mm wafers, with minimal vibration. The wafers are vacuum held in place, ensuring safe and secure handling throughout the process. In addition, the wafer transfer speed can be optimized for each production line. The wafer upending capability of this model is also noteworthy. SHINKO BX-080-070938-13 has been designed with an upending angle adjustment feature that can be finely tuned according to the process requirements. It can move the wafer up to a desired angle and, using the Z-axis stage, can lift and rotate wafers of up to 6mm thickness. In terms of safety, SHINKO BX80-070938-13 is equipped with interlocks and limit detection that reduces the risk of wafer damage and contamination. In addition, fail-safe air supply pressure management, as well as temperature and magnetic field sensors, are built in to provide a robust and reliable wafer handling operation. BX80-070938-13 is an industrial-grade, robust wafer-handling solution, engineered for precision and reliability. It provides a complete package of features and functions for transporting and handling 80mm wafers. With its advanced control algorithms and sophisticated design, it is an ideal solution for today's demanding production environments.