Used SHINKO BX80-07280 #9390316 for sale

SHINKO BX80-07280 Wafer Handler is an automated motion controller that safely and efficiently handles wafer and other fragile semiconductor components. It features a high-precision die placement system that can accurately handle wafer sizes up to 300 mm, making it ideal for use in semiconductor production. The wafer handler is equipped with several camera vision systems to accurately identify and locate the wafer within the bin on the machine. This allows the machine to use precision linear motors to accurately transfer the wafer to the designated slot. The wafer picking mechanism can handle wafers with a surface area of up to 300 mm. It features a patented "movable grip rod" which utilizes motion control technology to ensure that the wafers remain fixed during the rotation process, thereby minimizing any potential damage or scratches. In addition, the wafer handler is able to integrate seamlessly with Semiconductor Fabrication Equipment and other related test equipment. It also has the ability to recognize and control operations to minimize errors and improve productivity. The wafer handler is also capable of controlling multiple operations without compromising accuracy or precision. This allows for multiple wafers to be handled simultaneously with consistent accuracy and throughput rates. The machine is constructed with a stainless steel body and an electrostatic dissipative material on the surface. It features a stainless steel vacuum lid, and an optional liftable lid. Additionally, the wafer handler is designed with a user-friendly graphical user interface, allowing for easy set-up and operation. Overall, BX80-07280 Wafer Handler is a robust and reliable solution for the safe and efficient handling of wafer and other fragile semiconductor components. It features a high-precision die placement system, integrated Semiconductor Fabrication Equipment, multiple operation control capabilities, and a user-friendly graphical interface. All of these features combine to provide superior accuracy, throughput, and safety when handling delicate semiconductor components.