Used SPEEDFLO-MINI V5.11 #293659336 for sale
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SPEEDFLO-MINI V5.11 is an advanced wafer handler designed to improve wafer flip-chip process accuracy and reduce processing time. This high-performance wafer handler is suitable for both manual and automated production operations. It is equipped with multiple automation features to simplify the production process, allowing for increased accuracy and efficiency. SPEEDFLO-MINI V5.11 features a precision linear stepper motor that provides accurate movement and ensures smooth operation. Its high-trajectory tracking accuracy ensures repeatable precision wafer handling and placement. With a compact, lightweight design and quick-release interface, SPEEDFLO-MINI V5.11 is easy to integrate into existing production environments. SPEEDFLO-MINI V5.11 has an adjustable load force from 3-20N, and its maximum robot payload is up to 130 grams. It also supports up to six drive axes with the option to attach a seventh axis. This wafer handler has a programming interface with an intuitive graphical user interface (GUI) that simplifies programming tasks. Additionally, it has a variety of safety features, such as a built-in ground rod, over-voltage protection, and over-current protection, to ensure wafer handling reliability and minimize risks. SPEEDFLO-MINI V5.11 uses a dual-servo positioning system, which provides precise control and stability during operation. This system also allows for increased speed and flexibility, as well as improved process precision. Its flat-level wafer loading supports even the most complex wafer shapes and projects. SPEEDFLO-MINI V5.11 has a wide range of features and benefits that make it an ideal choice for wafer handling applications. It is capable of supporting various applications, such as laser-marking and bonding, photovoltaic device fabrication, and flip-chip module assembly. With its high accuracy and repeatability, as well as its advanced automation features, this wafer handler can help maximize the efficiency and precision of the production process.
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