Used ASM WS 896 #9181638 for sale

ASM WS 896 is a wafer stepper that uses a state-of-the-art optical microlithographic machine to expose and develop wafers for high volume IC and MEMS production. The equipment includes a multi-axis wafer-handling system, an integrated exposure subsystem, an advanced process-monitoring unit, and a fully automated wafer-cleaning station. The stepper uses a 300 mm per second stage speed (with acceleration/deceleration curves) to ensure accurate and high throughput patterning over a range of wafer sizes. In addition, laser-guided centering maps the wafer's peripheral edges for optimal placement accuracy. ASM WS896 features a high-resolution wafer positioning machine that permits large fields of scan to accommodate multiple exposure techniques. Its scanning optical equipment includes a variable numerical aperture projection with achromatic lenses and two exposure sources (g-line and i-line). The tool is also equipped with an advanced multi-zone stage, integrated with a closed-loop's scanner-to-stage synchronization asset for improved accuracy. The model utilizes advanced TTL and TTL with optional binary correction alignment techniques which are used to correct lithographic errors and ensure high-precision pattern placement. An automated bulk-loading equipment also ensures efficient wafer loading and unloading for improved throughput. In terms of process-monitoring capabilities, WS 896 is equipped with a proprietary imaging and critical dimension (CD) metrology system. This unit monitors pre- and post-exposure images of each die for automatic defect identification. Additionally, an optically-based process control machine is used to monitor gravure and non-gravure processes and detect process drift. The tool is also capable of automatically cleaning exposed wafers using a dry-based wet cleaning process. This process cleans the wafer surface without creating additional defects, improving wafer yield and quality. In sum, WS896 is a high-performance wafer stepper asset that can be used for high-volume IC and MEMS production. It has a high accuracy wafer positioning model which permits large fields of scan and utilises a closed-loop alignment equipment for improved accuracy. The system is also equipped with an imaging and CD metrology unit, an automated wafer-cleaning station, and an optically-based process control machine to ensure process stability.