Used ASML AT-850 #9193537 for sale

ASML AT-850 is a high-precision wafer stepper that is used in all stages of the semiconductor device fabrication process. It is designed to provide a comprehensive platform that allows for precise patterning and on-product testing. ASML AT 850 equipment utilizes a combination of advanced technologies, including lithography, reticle positioning, substrate alignment, heating and cooling, and stage motion to create highly complex structures on semiconductor substrates. The stepper's silicon-based lithography system is capable of an impressive 5nm resolution, allowing for the replication of complex circuit patterns. The unit is capable of accurately exposing and imaging patterns across four reticles in a single alignment mark, making it a great choice for high-volume production. The stepper's stage motion machine features advanced motors with a positioning resolution of 2.5nm, enabling the device to precisely position the substrate beneath the reticle prior to exposure. An electro-thermal actuator is used to ensure that the substrate temperature is uniform and stable during the exposure process. This thermal stabilization helps to minimize errors caused by temperature-induced variations in the performance of the wafer stepper. The reflective reticle positioning tool maintains the exact orientation of the reticle, thus providing for the accurate projection of the illumination image onto the substrate. The stepper is also equipped with a pattern alignment asset that ensures that the stage position is accurately aligned with the reticle at all times. Finally, the heater and cooling systems are essential components in the wafer stepper. A high-precision heating model is used to control the temperature of the substrate during the fabrication process, and a cooling equipment quickly brings the substrate to an acceptable temperature following the exposure process. Overall, AT-850 is an advanced wafer stepper that offers outstanding precision and high-volume production capabilities. The combination of its precise reticle positioning, substrate alignment, thermal management, and stage motion make it a great choice for creating highly complex structures on semiconductor materials.