Used ASML FLOW SUB B/D #9292389 for sale

ASML Flow Sub B/D is a wafer leveler equipment designed to provide real time control of wafer tape path length and wafer flatness. It is able to precisely measure, adjust, and compensate for variations in wafer tape geometry and surface quality. The system features a sophisticated mechanical and electronic control unit to provide the highest level of accuracy and repeatability in the resolution of wafer tape geometry and flatness. The machine utilizes an advanced dual-plane scanning tool to ensure optimal path length and flatness measurements. One plane is dedicated to the overview of the entire surface of the wafer, while the other plane is dedicated to in-depth of the surface. The overview scan enables the user to detect and measure large irregularities throughout the entire wafer surface as well as deep-level features. With this process, the user is able to detect and measure various electrical and/or optical features on the wafer. The in-depth scan provides more detailed measurements of smaller-scale features, giving users a better understanding of the wafer's surface. The asset includes a 4-axis motion model that is capable of handling large wafer sizes up to 300 mm in diameter. The equipment also includes 4 linear servo motors to ensure accurate and smooth motion control of the wafer. Additionally, the system includes a 9-axis motion control unit that is designed to precisely align the tape path to the wafer tape's exact geometry. To ensure the highest accuracy of the machine, the Flow Sub B/D includes a number of advanced optical alignment sensors with laser light projectors. This ensures that the tool tolerances are maintained within a high level of accuracy. It also allows the user to track wafer tape performance during long production runs and predictive maintenance requirements. The asset also includes a magnetic encoder model that provides facial recognition of the wafer and orientation registration. This face recognition equipment allows the system to accurately determine the orientation of the wafer and ensure that the wafer tape is properly aligned. The Flow Sub B/D is designed to be an efficient, reliable, and accurate tool for wafer levelers. With its advanced features and precise control unit, ASML Flow Sub B/D is capable of accurately measuring, adjusting, and compensating for variations in wafer tape geometry and flatness.