Used ASML PAS 2500 / 40 #9285750 for sale
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ID: 9285750
Wafer Size: 3"
Wafer stepper, 3"
Resolution, 0.7 µm
Reticle handling PCB
Stamp up / Down
Focus laser drive
Diode control
P-Chuck pre amplifier
Blades control
Blades DR
Motor relay
Relay card
Voltage current
Interference filter
Focus servo
Reticle table table control
Timing control card
Hinds modulator
Alignment counter
Alignment Mux + Dem
Velocity card
Bar code reader
Commutator
Charge amplifier
Wafer handling
Cyber termination
Floppy termination
2500x Table control
PAS 2500T Table control
Mains switch relay card
Pin spot sensor
Wafer quality and ambient
Signal conditioning board RMS
WH Pre amplifier HTW
HV Cable with ferrite Ring
Cables / Sensors
CYBEC Transmitter, 4"
CYBEC Receiver, 4"
Hard Disk Drive (HDD)
(3) P Chuck motors
Motor realignment unit (X/Theta Reticle handling)
Boards missing.
ASML PAS 2500 / 40 is a 193-nanometer binary step-and-scan photolithography machine, widely used in the fabrication of wafers used in the production of computer chips and other electronic components. ASML PAS 2500/40 is capable of producing patterns on wafers with sizes ranging from 100mm to 200mm with a maximum die size of 8" x 10". PAS 2500 / 40 utilizes a moveable optical equipment, featuring a pair of sextuple lenses that enable a changeable optical system. The lens provides high resolution resolution imaging and constant optical performance, making the unit suitable for high speed production. The use of Liquid Developers enables the machine to make direct-write exposures of a range of exposure doses with very low energy exposure. PAS 2500/40 utilizes a combination of an x-ray source, a laser source and a stepper-controlled wafer chuck. The x-ray source is used to illuminate the wafer, while the laser source is used to direct exposure dose to the wafer. The stepper-controlled wafer chuck allows the wafer to move during exposure, so that individual steps of the exposure process can be carried out accurately. ASML PAS 2500 / 40 also features several advanced technologies such as AutoFocus and Autoalign, allowing for automatic imaging and exposure with very high accuracy and uniformity. The tool also features a Scan-Focal Plane Slitting Asset, allowing for a range of wafer exposure steps to be carried out simultaneously. In addition, ASML PAS 2500/40 features software-controlled scanning process, which minimizes the number of exposures for a given layer. The machine also features a wide range of metrology tools that allow for optimum process control and optimization. PAS 2500 / 40 is an extremely reliable and versatile wafer stepper and is capable of delivering high accuracy, repeatability and robustness in the most demanding photolithography and test applications.
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