Used ASML PAS 5500 / 300 #9211288 for sale

ASML PAS 5500 / 300 is a wafer stepper used for photolithography in semiconductor manufacturing. It is a step-and-scan tool designed for ultra-high volume production and features a completely automated wafer handling equipment, offering consistent and repeatable exposure capabilities. The tool is capable of processing up to 300 mm silicon wafers, making it ideal for the production of complex system-on-a-chip (SoC) designs. ASML PAS 5500/300 comes equipped with a series of patented technologies, including full-field optics, laser interference lithography, and double-pass optics. The full-field optics unit features five lenses with 25 mm sag, providing 0.65 NA from mask to wafer for optimal imaging. Laser interference lithography (LIL) combines two-dimensional sinusoidal waveforms with traditional illumination to create high-resolution, binary features down to a minimum Linewidth@CD of 35 nanometers. Finally, the double-pass optics achieves 0.25 μm resolution across the full 25 mm field-of-view. PAS 5500 / 300 also features a dual-stage galvano scanner, capable of scanning the wafer over the full 300 mm with minimal distortion. The galvano scanner has a maximum scan speed of 30,000 lines/second and a maximum velocity of 0.5 m/s, providing high throughput and rapid cycle times. Additionally, the wafer stage has dual actuators to guarantee precise positional accuracy, and a vibration-absorbing machine to mitigate environmental disturbance. PAS 5500/300 has a fully automated wafer handling tool, providing precise placement of the wafer on the stage and easy transfer between the front and back of the processor. The front loader offers low-dislocation handling with minimal average wafer to wafer variation to create consistent exposure profiles. The chamber also features an atmospheric controller, providing consistent pressure and temperature for a range of load and process conditions. Overall, ASML PAS 5500 / 300 wafer stepper is an advanced tool with innovative technologies, offering ultra-high volume production and consistent, repeatable exposures. The combination of full-field optics, LIL, double-pass optics, fastscanning, and automated wafer handling make the tool ideal for producing complex SoC designs with high-resolution, low-Linewidth@CD features down to 35 nanometers.