Used ASML PAS 5500 / 300B #293817865 for sale

ASML PAS 5500 / 300B
Manufacturer
ASML
Model
PAS 5500 / 300B
ID: 293817865
Stepper Numerical Aperture (NA): 0.40-0.57 Resolution: 250 nm Throughput (WPH): 80.
ASML PAS 5500 / 300B is a 300 mm high-performance wafer stepper for advanced semiconductor device processing. This equipment provides ultra-high throughput and advanced patterning performance with a maximum resolution of 0.1 microns. PAS 5500 / 300B is an advanced optical step and repeat lithography system. It is based on the KrF, ArF, and ArF-plus excimer lasers, allowing for a wide range of lithographic process capability. With the patented PAS300 series Superior Process Capability (SPC) technology, this unit is able to image the most complex patterns. It also offers industries unmatched overlay and focus accuracy, making it ideal for producing the latest nanometer-scale devices. This machine is vertically integrated and includes two precision stages, a laser, an illuminator, an objective lens, a wafer holder, and an in-situ scanner. ASML PAS 5500 / 300B is capable of patterning many different materials including photosensitive resins, GaAs, and ZnS. It offers an industry-leading optical resolution of 0.1 microns, with a minimum feature size of 0.4 microns. This allows for extremely precise etching and patterning. As an advanced tool, PAS 5500 / 300B is equipped with several specialized features. These include the interferometric monitoring asset, wafer centering adjuster, and intra-field edge placement optimization technology. With these designs, the model is able to achieve incredibly high pattern fidelity with minimal line-width variation. This equipment is designed for ultra-high throughput. With the septuplet capability of its 4-lens system, ASML PAS 5500 / 300B can process 8 wafers simultaneously. It also has flexible job-processing sequences and the option to run timecritical lithography tasks. With its user-friendly interface, PAS 5500 / 300B offers accuracy and speed combined with low cost to the user. The unit can support a wide range of process-friendly wafers, from 3-inch to 8-inch and is perfectly suited for advanced photomask applications. With its superior patterning performance and robust design, this machine is the ideal solution for semiconductor device processing.
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