Used ASML PAS 5500 / 60 #9276126 for sale

ASML PAS 5500 / 60 is an advanced, technologically-enabled wafer stepper equipment that has the capability to manufacture and assemble a high-precision array of integrated circuits (ICs) with the aid of a set of mirrored lenses. The system allows for the fabrication of tiny and intricate ICs that are essential to the semiconducting industry. The main components of ASML PAS 5500/60 include a high-precision X, Y, and Z stage; a G-type air bearing stepper; a pair of movable twin lenses; an automated focus unit; a large-format photo-resist coating station; a wafer-spinning motor; and a multi-angle exposure table. The entire machine is designed to accommodate a wide range of IC manufacturing sizes and requirements. PAS 5500 / 60 utilizes a G-type air bearing stepper, which allows for the rapid stepping of wafers at sub-micron accuracy. A wide range of chip sizes can be accommodated, from NOR-sized chips up to 256MB-sized chips. The stepper is also designed to automatically adjust orientation and focus settings for any range of chip sizes. The mirrored lenses of PAS 5500/60 provides the best resolution for the intricate ICs. This allows for precise placement and positioning of circuitry on the ICs. With the help of the automated focusing tool, the lens is able to adjust itself to keep the ICs in perfect focus for better performance. The photo-resist coating station of ASML PAS 5500 / 60 is able to provide a high-quality photo-resist layer in various thicknesses, depending on the size and complexity of the ICs that needs to be manufactured. The wafer-spinning motor also allows for accurate orientation of the ICs during fabrication and assembly. Finally, the multi-angle exposure table of ASML PAS 5500/60 provides multiple angles of exposure for the IC, depending on the design requirements of the chip. This allows for accurate and precise lithography, which is essential for building ICs with complex structures. Overall, PAS 5500 / 60 is a groundbreaking technology that provides industrial-level performance and precision in the production and assembly of integrated circuits. This advanced technology ensures accurate and reliable IC production, allowing for greater productivity in the semiconductor industry.