Used ASML XT 760F #9243126 for sale

ASML XT 760F is a wafer stepper that coordinates optical, mechanical, and computational functions for the purpose of lithography in semiconductor production. It is capable of increasing multi-project wafer throughput up to four times faster than its predecessor and comes equipped with a 2K vacuum chuck and fully AUTO DCG/DCP. ASML XT:760F comes with a choice of a 5X/6X high numerical aperture system for either i-line or ArF lithography. It is equipped with a double field scan neural network with improved focus reticle and lens tuner. The double field scan neural network has the ability to detect contoured, curved surfaces. A field-matched FXLTM reticle ensures non-uniform pitch patterns across the wafer's entire surface. XT 760 F is designed with an 11-degree scan to create an extremely low distortion and super-accurate placement of optical fields onto the wafer. It boasts a fast-tuning system (FTS) for quick reticle exchange and maximum optical field size of 30 µm for advanced features. Plus, XT 760F is equipped with a wide range of capabilities, including low defectivity via defect dose prediction, 4D stitching for increased uniformity, and advanced wafer-level datalogging. ASML XT 760 F offers improved image and overlay quality when compared to older wafer steppers. This is thanks to its improved pattern correction and auto-exposure algorithms with better repeatability across exposure fields. The wafer stepper is managed using a Windows-based Graphical User Interface and menu-driven software operation. XT:760F can be customized for any application by adding additional options, including contact imaging, chrome or scan cleaner/booster configurations. The wafer stepper also has a built in safety module to rapidly detect abnormal photomask or printed conditions. ASML XT 760F continues ASML tradition of quality wafer steppers at an affordable price. It features state-of-the-art components and a design with improved quality and performance. With ASML XT:760F, customers can expect maximum wafer mounted defect prevention and higher yields.