Used ASML XT 760F #9305673 for sale
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ID: 9305673
Wafer Size: 12"
Vintage: 2006
DUV Scanner, 12"
External interface module
Bottom module
Reticle stage
Covering panels frame parts
Covering panels frame MCAB
Covering panels
RSRC Cabinet
MCWC Cabinet
MDC Cabinet
LCWC Cabinet
Exhaust cabinet
Machine parts clean folder
Side channel blower
(6) Machine parts
Double stage
Hard Disk Drive (HDD), 4.1.0
Locking kit
TAMIS (EMTA):
Z7 Offset: ±4.0 nm (-5.96)
Z8 Offset: ±4.0 nm (-1.11)
Z7 Tilt in X: ±2.0 nm/cm (-0.04)
Z9 Offset: ±4.0 nm (0.48)
SAMOS (EMCA):
SAMOS: ≤3% (1.74)
SLIT Uniformity (LUSU):
- / NA / S.In / S.Out / Control spec / Down spec / Result
Annular (M-Action) / 0.7 / 0.55 / 0.85 / 1.50% / 3.00% / 0.31
Conventional / 0.65 / 0 / 0.75 / 1.50% / 3.00% / 0.26
Conventional / 0.7 / 0 / 0.6 / 1.50% / 3.00% / 0.28
Model result parameter:
Best focus: ±0.015 (0.002)
Image height C1 (um): 0 ±0.015 (0.002)
Image height C2 (um): 0 ±0.015
Image height different (um): 0 ±0.015
Image tilt ry C1 (urad): 0 ±0.5 (-0.279)
Image tilt ry C2 (urad): 0 ±0.5
Image tiltry different (urad): 0 ±0.5
Intrafield:
Focus range chuck 1 Before: <120 nm (91.6)
Focus range chuck 2 Before: <120 nm
Focus range chuck 1 After: <120 nm (89)
Focus range chuck 2 After: <120 nm
Focus range C1 different (nm): 0 +15 (2.6)
Focus range C2 different (nm): 0 +15
Astigmatism range C1 different (nm): 0 ±5 (0.6)
Astigmatism range C2 different (nm): 0 ±5
Result after correction:
IPD Mean (nm): <120 (89)
IPD STDEV (nm): <10
Astigmatism mean (nm): <70 (36)
Astigmatism STDEV (nm): <10
Dose accuracy and repeatability performance (ODAR):
Dose accuracy: <2.0 (max) (1.416)
Dose repeatability: <0.5 (0.057)
CYMER Laser not included
2006 vintage.
ASML XT 760F is a next-generation advanced wafer stepper designed to serve as a market-leading solution for the production of advanced semiconductor devices. ASML XT:760F is a wafer stepper that supports technologies such as deep ultraviolet lithography (DUV) and excimer laser lithography (EUV). It provides superior precision and high-throughput rates to further optimize the semiconductor production process. XT 760 F offers a number of advanced features which sets it apart from conventional wafer steppers. It features a high-speed, dual-axis sub-micron stage equipment which provides the highest levels of accuracy and stability. The dual-axis system utilizes position encoders and position sensing servo motors, along with adaptive feed forward/feedback control algorithms to provide extremely accurate positioning of the wafer in the stepper. Additionally, ASML XT 760 F provides a highly reliable aberration correction unit that ensures image quality is maintained over the entire area of the wafer, even at the steepest level of Nikon projection optics. XT 760F also features a modular design which allows for a flexible and easily adjustable machine. The modular design provides maximum protection to the optics of the wafer stepper by eliminating any factor that could result in an unacceptable change in wafer action or alignment. The advanced control tool of XT:760F also allows for the integration of additional processes such as etching and polishing. ASML XT 760F provides impeccable wafer treatment in accordance with ISO/EEE 9000 standards, including uniform exposure throughout the wafer surface. The process parameters are uniform and repeatable, even following multiple exposures. Additionally, ASML XT:760F is capable of running at extremely high throughput speeds with low residual wafer performance. By achieving superior repeatability of wafer treatment, XT 760 F ensures that the advanced semiconductor device production process is carried out at the highest possible levels of accuracy. In summary, ASML XT 760 F is an advanced wafer stepper that offers superior precision, high throughput rates, excellent image quality, and high repeatability, making it a market-leading solution for the production of advanced semiconductor devices.
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